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Выставка BondexpoTrade fair for industrial bonding technology
Дата проведения:
6–9 октября 2014
Bonding — the motor for innovative joining technology. Adhesive technology has established itself in all areas of industrial production and assembly as a bonding process solution that is of equal, if not superior standing and which can easily be implemented as an automated process.
Bonding involves a lot more than simply connecting different materials with diverse surface structures. Adhesives seal and insulate, serve as joint sealing compounds and turn a variety of materials into highly-resistant composite materials.
Bondexpo — the platform for adhesive technology. The importance of adhesives and adhesive technologies as a construction element in the area of joining and its extended functions is totally underestimated to this day. The same can be said about the possibilities for rationalisation that the use of adhesives and adhesive technology opens up.   The expert trade fair Bondexpo looks at these issues and for the first time presents the entire world of adhesive technology to an expert audience. Bondexpo — sector meeting where «lasting bonds are made». The trade fair Bondexpo has been designed to be a practical sector get-together, intended to introduce customers and professional operators to the varied uses and application possibilities of adhesives. Whether manufacturers of adhesives, sealants and sealing compounds or suppliers of dosing and application installations — the Bondexpo is the only sector platform worldwide and brings together suppliers and users. While a thoroughly worked-out glossary ensures the necessary «grip keeps feet on the ground», a selection of peripheral seminars and expert lectures guarantees interesting and comprehensive information is at hand. Детализация тематики выставки Bondexpo
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